LOCTITE PL 300 28 Oz. Low VOC Foam Board Construction Adhesive

A premium grade formulation for bonding foam board insulation to a variety of surfaces, interior or exterior. Compatible with all foam board insulation products. Latex based adhesive especially designed for bonding polystyrene foam to itself or to a variety of construction materials, including, but not limited to: Wood, gypsum board, concrete, and brick. Do not…

Original price was: $10.00.Current price is: $3.00.
Checkout

Description

A premium grade formulation for bonding foam board insulation to a variety of surfaces, interior or exterior. Compatible with all foam board insulation products. Latex based adhesive especially designed for bonding polystyrene foam to itself or to a variety of construction materials, including, but not limited to: Wood, gypsum board, concrete, and brick. Do not use when: Temperatures are lower than 40 deg. F. (5 deg. C.) or above 100 deg. F. (38 deg. C.). Do not use on polyethylene, polypropylene, polytetrafluoroethylene and acrylic. Do not use on areas subject to permanent water immersion. Do not apply outside if rain is expected within 12 hours, or apply to wet surfaces. Not recommended for bonding panels to nonporous surfaces (one surface must be porous). Low VOC formulation meets stringent State and Federal VOC regulations. Nonflammable. Uncured adhesive cleanup: Soap and water. Cured adhesive cleanup: Cut or scrape. Color: Light blue. Coverage Area: 10 Oz. size – 30.6 Ft. at 1/4 In. Bead, 13.6 Ft. at 3/8 In. Bead. 28 Oz. size – 85.8 Ft. at 1/4 In. Bead, 38.1 Ft. at 3/8 In. Bead.

Color Light Blue
Shelf Life 24 Mos.
Interior/Exterior Interior/Exterior
Cure Time 7 Days
Stainable/Paintable No
UV Resistant No
Drillable No
Flammable No
Moisture Resistant Yes
Sandable No
Container Size 28 Oz.
Color Family Blue
Dries Clear No
Brand LOCTITE
UPC 00079340686526
Product type Foam Board Adhesive

Reviews

There are no reviews yet.

Be the first to review “LOCTITE PL 300 28 Oz. Low VOC Foam Board Construction Adhesive”

Your email address will not be published. Required fields are marked *